Soder-wick Desoldering Braid
Soder-Wick®, the world's leading brand of desoldering braid, is the fastest, cleanest and safest braid in the industry. It significantly reduces rework/repair time and minimizes the risk of heat damage to the board. Its geometrically precise weave design allows for maximum capillary action and solder capacity. Soder-Wick® Desoldering Braid optimizes heat transfer through the braid and into the solder joint, resulting in faster wicking action than any other competitive brand. Minimal flux residue on the board speeds up the cleaning process, or eliminates it entirely. Soder-Wick® Desoldering solder wick Braid is available in the most comprehensive variety of widths, lengths and flux types. Application-specific sizes allow for precision solder removal in a flash. Sealed in Performance Pak™ Barrier Packaging and VacuPak™ Vacuum Sealed Packaging, Soder Wick Desoldering Braid is completely protected from the harmful effects of the environment. The VacuPak™ vacuum-sealed can guarantees the braid to be as fast and fresh as the day it was made. The can serves as a protective storage container once the pack has been opened and is also easily stacked on the shelf. Its superior packaging provides predictable quality and performance, time and time again.

Soder-Wick® No Clean SD - Single

Soder-Wick® No Clean is designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick® No Clean
uses pure, oxygen free copper braid and a patented flux technology to make an efficient and effective desoldering braid. Soder-Wick® No Clean SD is available on ESD safe bobbins for protection against damage due to static electricity.

Features:

    Soder-Wick® No Clean packaged in ESD-safe static dissipative bobbins
    Minimizes the risk of damage associated with static electricity
    Patented noncorrosive, halide free, organic no-clean flux
    Desolders up to 40% faster than competitive no-clean braids and leaves boards cleaner
    Meets Bellcore TR-NWT-000078 and ANSI IPC SF-818 for Surface Insulation Resistance
    Soder-Wick® No Clean SD safely removes solder in all applications requiring Type ROL0 flux
    0.080"/2.0mm width
    5' / 1.5 m length
    No Clean - green label on SD bobbin
     

Specifications
MIL-F-14256F, Type R
NASA-STD-8739.3
DOD-STD-883E, Method 2022
ANSI/IPC J STD-004, Type ROL0
Bellcore TR-NWT-000078
ANSI/IPC J SF-818
MIL-STD-2000A
MIL-B-81705C
MIL-STD-1686C
MIL-HDBK-263B